http://www.fullsunled.com/custom_20562.html 免封裝COB與焊線式COB -優缺點比較【詳細資料,請進入】 免封裝COB與焊線式COB -優缺點比較【詳細資料,請進入】 ※免封裝DOB(COB) 與 焊線式COB 優缺點比較 免封裝DOB(COB)--馥珅光電焊線式COB1.組裝防呆無壓斷金線風險有壓斷金線風險2.結構簡單傳統且穩定的錫膏固晶製程約90%不良為金線剝落或斷裂3.極低熱阻以高導熱錫膏做導熱唯一路徑導熱須經導熱差的藍寶石與固晶膠材4.極低Tj同規格DOB(COB),免封裝於350mA電流僅176℃同規格COB,焊線式於240mA電流達192℃5.極小溫差同規格DOB(COB),免封裝因Tj與Tp溫差小,容許最高板溫可達95℃同規格COB,焊線式因Tj與Tp溫差大,容許最高板溫可達85℃6.獨立失效單顆LED失效時,不會使相鄰LED跟進失效單顆LED失效時,會使其同串聯LED跟進失效7.高載電流同規格DOB(COB),免封裝於680mA達飽和同規格COB,焊線式於480mA即達飽和8.高壽命一倍~三倍電流皆無光衰或死燈不良情形二倍電流僅剩77%光束維持率,350ma電流死燈 
※馥珅光電接受訂製規格生產,請撥04-2358-3333 將有專人為您服務,謝謝。馥珅是業界原創免封裝LED (WLCSP LED)、覆晶LED、倒裝LED、Flip chip 專業技術研發團隊並唯一持有專利者。秉持不斷精進產品特性、創造產品創新優勢,追求高品質的我們,產品更值得推薦給您。We accept to customize production specifications, please call +886 4 2358 3333. thank you. Full Sun is an original professional team for Flip chip, also the only company has patent. Full Sun provides total solution of LED makers including Flip chip, wlcsp (wafer level chip scale packaging ) , COB and components for LED packaging.